ST. PETERSBURG, Fla. – Velera has announced the establishment of the Velera Innovation Alliance (VIA), which it said is an extension of Velera’s Fintech Engagement Program announced in April 2024.
According to Velera, VIA is a “visionary body aimed at navigating the opportunities and challenges associated with new technologies, identifying and assessing innovative solutions, and introducing new concepts into the credit union sector to enable competitiveness and strengthen the sustainability of credit unions in the digital financial ecosystem.”
Identifying ‘Innovative Opportunities’
“With the rise of fintech and the increasing importance of digital capabilities in today’s financial landscape, Velera is excited to shape and influence innovation within our industry alongside our fellow credit union leaders through the Velera Innovation Alliance,” Vladimir Jovanovic, vice president of innovation, said in a statement. “Together, we will explore cutting-edge technologies, identify innovative opportunities, engage in active participation for proof-of-concept (POC) initiatives and ultimately support and promote our Fintech Engagement Program across the credit union industry.”
13 Execs Involved
According to the company, the VIA will be comprised of 13 executives from a diverse group of credit unions that are committed to upholding the VIA mission.
“These esteemed fintech innovators and leaders – all of which are passionate about ideation – will participate in POC planning and testing, providing feedback on POCs that are being developed by their peers and fellow VIA members,” Velera said in a statement. “They will also engage in discussions about areas of focus for their respective credit unions and contribute insights into criteria for partnering with fintech companies.”
Meeting in September
The first VIA meeting will be held in September 2024.
As part of the Fintech Engagement Program, the VIA will be supported by the Innovation team within Velera’s Emerging Services department, the company said.
For info: pscu.com/fintech.